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A stopband enhanced EBG power/ground plane based on via location design

机译:基于通孔位置设计的阻带增强型EBG电源/地平面

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A novel electromagnetic bandgap (EBG) structure power/ground plane by using multilayer stack-up structure and multiple vias is proposed. A wide stopband exhibited by the proposed EBG structure is used to suppress the power noise coupling between power/ground plane in the package. Both the upper and lower side cutoff frequencies are enhanced through the via connection and location design. A simplified one-dimensional equivalent model is established to explain the concept of the stopband enhancement. Different via position and the resultant bandgap variation are demonstrated by both dispersion diagram and S-parameter.
机译:提出了一种利用多层堆叠结构和多个通孔的新型电磁带隙(EBG)结构电源/地平面。所提出的EBG结构表现出的宽阻带用于抑制封装中电源/接地层之间的电源噪声耦合。通过通孔连接和位置设计,可以提高上,下侧截止频率。建立简化的一维等效模型来解释阻带增强的概念。色散图和S参数都说明了不同的通孔位置和由此产生的带隙变化。

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