The handheld wireless product market place demands products that are small, thin, low-cost and lightweight and improved user interfaces. In addition, the convergence of handheld wireless phones with palmtop computers and Internet appliances is accelerating the need for functional circuits designed with smallest, low-cost technologies.The miniaturization of portable electronics and Mobile handsets is resulting in thin form factor cell phones, camera modules and Bluetooth packages. The consumer appeal for sleek phones is driving the need for thin PWB roadmaps for the handset. [1]Qualification of thin PWBs (less than 0.8mm) require careful evaluation of PWB stackup for warpage, delamination and successful lead free reflow and rework. The paper presents the qualification testing of thin PWBs for warpage characteristics. X-sectional analysis, shear testing, thermal shock, temp. Humidity testing and drop test for long-term reliability.
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