首页> 外文会议>Electron Devices Meeting (IEDM), 2009 >A new and simple experimental approach to characterizing the carrier transport and reliability of strained CMOS devices in the quasi-ballistic regime
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A new and simple experimental approach to characterizing the carrier transport and reliability of strained CMOS devices in the quasi-ballistic regime

机译:一种新的简单实验方法来表征准弹道状态下应变CMOS器件的载流子传输和可靠性

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A new yet simple approach, VD,sat method, without complicate temperature measurement setup, has been developed to investigate the carrier transport characteristics for MOSFET devices in the quasi-ballistic regime. It has shown quite good matches with that of Temperature Dependent Method (TDM) developed from the quantum theory. For the first time, the carrier transport properties after HC stress were also examined based on the proposed method. Moreover, VD,sat method has been applied to examine the carrier transport and reliabilities in advanced strain-CMOS devices. In terms of the device performance, the enhancement of the drain current is strongly related to the transport parameter, the injection velocity, Vinj, which serves as a good monitor for the strain design and current enhancement. While, considering the device reliability after the HC stress, ballistic efficiency, Bsat is responsible for the ID degradation as a result of the increase in interface scatterings. Finally, a roadmap of the Vinj from those reported results has been provided which serves as a good reference for designing high performance strain- based CMOS devices.
机译:已经开发了一种新的但简单的方法,即V D,sat 方法,无需复杂的温度测量设置,以研究准弹道状态下MOSFET器件的载流子传输特性。它已显示出与从量子理论发展而来的温度相关方法(TDM)的良好匹配。首次,基于所提出的方法,还研究了HC应力后的载流子传输性质。此外,V D,sat 方法已被应用于研究先进应变CMOS器件中的载流子传输和可靠性。就器件性能而言,漏极电流的增强与传输参数,注入速度V inj 密切相关,这可以作为应变设计和电流增强的良好监测器。同时,考虑到HC应力后的设备可靠性,弹道效率,B sat 会由于界面散射的增加而导致ID下降。最后,从这些报告的结果中提供了V 的路线图,该路线图可为设计高性能基于应变的CMOS器件提供良好的参考。

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