Fabrication of SAW devices with small package size using through substrate via technology

摘要

In order to realize SAW devices with smallest package size and investigate possibility of three dimension packaging of SAW devices, we propose the novel packaging method of SAW devices, in which two same SAW devices with half size of overlap length of the original device are bonded in face to face structure and two same SAW devices are electrically connected in parallel by through substrate via technology. We investigated processes conditions of the through substrate via electrode for piezoelectric substrate. We also investigated effect of some parameters such as through substrate via electrode material, bonding conditions. We fabricated test devices using Quartz substrate. Experimental results indicated that there is no change in the frequency characteristics between half size devices bonded and original devices.