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外文会议>Electron Devices Meeting (IEDM), 2009
>Vth fluctuation suppression and high performance of HfSiON/metal gate stacks by controlling capping-Y2O3 layers for 22nm bulk devices
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Vth fluctuation suppression and high performance of HfSiON/metal gate stacks by controlling capping-Y2O3 layers for 22nm bulk devices
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机译:通过控制22nm批量器件的Caping-Y 2 inf> O 3 inf>层,抑制HfSiON /金属栅叠层的第V inf>波动和高性能
We have succeeded in suppressing random threshold voltage (Vth) fluctuations by controlling capping-layers and high-k materials with metal gate first stacks for 22 nm-node devices. By employing 1-2 mono Y2O3-layers on HfSiON films, Vth fluctuations are the same as with non-capped samples, while maintaining excellent Vth controllability (|ÃÂÿVth| > 180 mV). Furthermore, the devices exhibit high device performance because ultra-thin equivalent-oxide-thickness (EOT: 0.74 nm) can be achieved with high electron carrier mobility, and very high drain current (Ion > 1060 ÃÂÿA/ÃÂÿm) at an Ioff value of 100 nA/ÃÂÿm.
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机译:我们已经成功通过控制22 nm节点器件的金属栅第一叠层来控制覆盖层和高k材料,从而抑制了随机阈值电压(V )的波动。通过在HfSiON膜上使用1-2个单层Y 2 sub> O 3 sub>层,第V sub>波动与无盖样品相同,同时保持出色的V th sub>可控性(|ƒÂ,,V >>> 180 mV)。此外,该器件还具有很高的器件性能,因为可以实现高电子载流子迁移率和非常高的漏极电流(I sub>> 1060×)的超薄等效氧化物厚度(EOT:0.74 nm)。 I / sub = 100 nA /μm的I off sub>值。
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