首页> 外文会议>International conference on compound semiconductor MANufacturing TECHnology;CS MANTECH >HfO_2-based Metal-Oxide-Semiconductor Capacitors on n-InGaAs Substrate with a Thin Germanium Passivation Layer
【24h】

HfO_2-based Metal-Oxide-Semiconductor Capacitors on n-InGaAs Substrate with a Thin Germanium Passivation Layer

机译:具有薄锗钝化层的n-InGaAs衬底上的基于HfO_2的金属氧化物半导体电容器

获取原文

摘要

The effect of a germanium (Ge) interfacial passivation layer (IPL) on the capacitance-voltage (C-V) and current density-voltage (J-V) characteristics of TaN/HfO_2/Ge-InGaAs metal-oxide-semiconductor capacitors(MOSCAPs) were studied. In comparison to MOSCAPs on GaAs, the results from the accumulation region were quite similar, while the C-V curves in the inversion region were substantially different owing to the different energy bandgap. By using 8 ~ 10 A Ge IPL and 60~70 A HfO_2, MOSCAPs on InGaAs exhibited an equivalent oxide thickness (EOT) of ~ 11 A and gate dielectric leakage current density (J_g) of ~ 10~(-5) A/cm~2 at V_g-V_(FB)=1 V with good C-V frequency dispersion, whereas poor electrical characteristics were obtained from the devices without a thin Ge IPL. These results show that a thin Ge IPL in optimal conditions passivates InGaAs surface effectively and provides a high quality interface.
机译:锗(Ge)界面钝化层(IPL)对TaN / HfO_2 / Ge / n-InGaAs金属氧化物半导体电容器的电容-电压(C-V)和电流密度-电压(J-V)特性的影响 (MOSCAPs)进行了研究。与GaAs上的MOSCAP相比,累积区域的结果非常相似,而由于能量带隙的不同,反型区域的C-V曲线也大不相同。通过使用8〜10 A Ge IPL和60〜70 A HfO_2,InGaAs上的MOSCAP表现出的等效氧化物厚度(EOT)为〜11 A,栅介电泄漏电流密度(J_g)为〜10〜(-5)A / cm V_g-V_(FB)= 1 V时〜2,具有良好的CV频率色散,而从薄Ge IPL的器件获得的电特性较差。这些结果表明,在最佳条件下的薄Ge IPL可有效钝化InGaAs表面并提供高质量的界面。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号