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HfO_2-based InP n-channel metal-oxide-semiconductor field-effect transistors and metal-oxide-semiconductor capacitors using a germanium interfacial passivation layer

机译:基于HfO_2的InP n沟道金属氧化物半导体场效应晶体管和使用锗界面钝化层的金属氧化物半导体电容器

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摘要

In this letter, we present our experimental results of HfO_2-based n-channel metal-oxide-semiconductor field-effect transistors (MOSFETs) and metal-oxide-semiconductor capacitors (MOSCAPs) on indium phosphide (InP) substrates using a thin germanium (Ge) interfacial passivation layer (IPL). We found that MOSCAPs on n-InP substrates showed good C-V characteristics such as a small capacitance equivalent thickness (14 A), a small frequency dispersion (<10 % and <200 mV), and a low dielectric leakage current (~5 × 10~(-4) A/cm~2 at V_g=1.5 V), whereas MOSCAPs on p-InP exhibited poor characteristics, implying severe Fermi level pinning. It was also found that InP was more vulnerable to a high temperature process such that C-V curves showed a characteristic "bump" and inversion capacitance at relatively high frequencies. From n-channel MOSFETs on a semi-insulating InP substrate using Ge IPL, HfO_2, and TaN gate electrodes, excellent electrical characteristics such as a large transconductance (9.3 mS/mm) and large drain currents (12.3 mA/mm at V_d=2 V and V_g= V_(th) + 2V) were achieved, which are comparable to other works.
机译:在这封信中,我们介绍了我们在使用稀锗(InP)的磷化铟(InP)衬底上的基于HfO_2的n沟道金属氧化物半导体场效应晶体管(MOSFET)和金属氧化物半导体电容器(MOSCAP)的实验结果。 Ge)界面钝化层(IPL)。我们发现,n-InP基板上的MOSCAP具有良好的CV特性,例如较小的电容等效厚度(14 A),较小的频率色散(<10%和<200 mV)和较低的介电泄漏电流(〜5×10)在V_g = 1.5 V时约为〜(-4)A / cm〜2),而p-InP上的MOSCAP表现出较差的特性,这意味着严重的费米能级钉扎。还发现InP更容易受到高温过程的影响,因此C-V曲线在相对较高的频率下显示出特征性的“凸点”和反相电容。从使用Ge IPL,HfO_2和TaN栅电极的半绝缘InP衬底上的n沟道MOSFET获得出色的电气特性,例如大跨导(9.3 mS / mm)和大漏极电流(V_d = 2时为12.3 mA / mm)达到了V和V_g = V_(th)+ 2V),这与其他工作相当。

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