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Isothermal Fatigue Tests Of Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints At 60oC

机译：塑料球栅阵列（PBGA）SnAgCu无铅焊点在60oC时的等温疲劳试验

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《Electronic Components and Technology Conference, 2006. Proceedings. 56th》|2006年|P.1476-1483|共8页
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Lau; J.; Lee; S.W.R.; Fubin Song; Lau; D.; Dongkai Shangguan;
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1. Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition [J] . Qiang Guo, Mei Zhao, Zhen-jun Zhu, The International Journal of Advanced Manufacturing Technology . 2006,第9a10期

机译：航天PBGA（塑料球栅阵列）焊点的可靠性：在连续高加速度冲击条件下
2. Astronautic PBGA (plastic ball grid array) solder joints' reliability: under successive-high acceleration shock condition [J] . Qiang Guo, Mei Zhao, Zhen-jun Zhu, The International Journal of Advanced Manufacturing Technology . 2006,第9a10期

机译：航天PBGA（塑料球栅阵列）焊点的可靠性：在连续高加速度冲击条件下
3. Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester [J] . Yuhuan Xu, Shengquan Ou, K.N. Tu, Journal of Materials Research . 2008,第5期

机译：用微型冲击试验仪测量球栅阵列中共晶SnPb和SnAgCu焊点的冲击韧性
4. Isothermal Fatigue Tests Of Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints At 60oC [C] . Lau J., Lee S.W.R., Fubin Song, Electronic Components and Technology Conference . 2006

机译：塑料球栅格阵列的等温疲劳试验（PBGA）SNAGCU无铅焊点60℃
5. Solder joint reliability of plastic ball grid array (PBGA) and bottom-leaded plastic (BLP) assemblies. [D] . Zhang, Xiaowu. 1999

机译：塑料球栅阵列（PBGA）和底铅塑料（BLP）组件的焊点可靠性。
6. Reliability issues of lead-free solder joints in electronic devices [O] . Nan Jiang, Liang Zhang, Zhi-Quan Liu, 2019

机译：电子设备中无铅焊点的可靠性问题
7. Solder joint reliability of plastic ball grid array with solder bumped flip chip [O] . Shi‐Wei Ricky Lee, John H. Lau 2000

机译：塑料球栅格阵列的焊接接头可靠性，带焊料撞击芯片

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