首页> 外文会议>Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on >High tunability (Ba,Sr)TiO3 thin films on atomic layer deposited buffer layers for Si integration
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High tunability (Ba,Sr)TiO3 thin films on atomic layer deposited buffer layers for Si integration

机译:在原子层上沉积的用于Si集成的缓冲层上的高可调性(Ba,Sr)TiO 3 薄膜

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In this study, we report on Si integration of Ba0.6Sr0.4TiO3 (BST) thin film based microwave tunable devices by use of TiO2 films as microwave buffer layer between BST and Si substrates. TiO2 buffer layer were grown by atomic layer deposition (ALD) onto Si substrates followed by pulsed laser deposition (PLD) of BST thin films onto the TiO2 buffer layer. The interdigital capacitor (IDC) fabricated on BST films grown on TiO2/high resistivity Si substrates showed much enhanced tunability value of 33.2% while retaining an appropriate Q factor, as compared to 21% value obtained with BST films grown on MgO single crystal substrates. The microwave phase shifters were fabricated on BST thin films to investigate the potential feasibility of integrating BST films as microwave tunable devices. The phase shifter fabricated on BST films grown on TiO2/Si substrate showed better figure of merit (FOM) of 30.7° /dB, as compared to 12.1° /dB of BST/MgO structure. ALD grown TiO2 buffer layers enable successful integration of BST based microwave tunable devices onto high resistivity Si wafers.
机译:在这项研究中,我们报道了使用TiO的Ba 0.6 Sr 0.4 TiO 3 (BST)薄膜可调谐器件的Si集成 2 膜作为BST和Si衬底之间的微波缓冲层。 TiO 2 缓冲层通过原子层沉积(ALD)沉积在Si衬底上,然后将BST薄膜的脉冲激光沉积(PLD)沉积到TiO 2 缓冲层上。在TiO 2 /高电阻率Si衬底上生长的BST膜上制造的叉指电容器(IDC)的可调谐性值提高了33.2%,同时保留了适当的Q因子,而BST可获得21%在MgO单晶衬底上生长的薄膜。在BST薄膜上制造了微波移相器,以研究将BST薄膜集成为微波可调谐设备的潜在可行性。与在BST / MgO结构上的12.1°/ dB相比,在TiO 2 / Si衬底上生长的BST膜上制造的移相器具有更好的品质因数(FOM),为30.7°/ dB。 ALD生长的TiO 2 缓冲层可将基于BST的微波可调器件成功集成到高电阻率的Si晶片上。

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