首页> 外文会议>Reliability Physics Symposium Proceedings, 2004. 42nd Annual >Effects of thin SiN interface layer on transient I-V characteristics and stress induced degradation of high-k dielectrics
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Effects of thin SiN interface layer on transient I-V characteristics and stress induced degradation of high-k dielectrics

机译:薄SiN界面层对瞬态I-V特性和应力引起的高k电介质降解的影响

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In this work, we present the effects of a SiN interface on charge trapping and de-trapping characteristics and time-dependent threshold voltage instability. The use of SiN interface structure was found to reduce the degradation in D/sub it/ and G/sub m/ even though it yielded higher bulk charge trapping. The higher bulk trap was evidenced from larger after-stress V/sub th/ degradation. Thus, it is believed that mobility degradation in HfO/sub 2/ is primarily caused by the degraded quality of the interfacial layer.
机译:在这项工作中,我们介绍了SiN界面对电荷俘获和去俘获特性以及与时间有关的阈值电压不稳定性的影响。发现使用SiN界面结构减少了D / sub it /和G / sub m /的降解,即使它产生了更高的整体电荷俘获。从较大的后应力V / sub th /降解可以证明较高的体积陷阱。因此,据信HfO / sub 2 /的迁移率降低主要是由界面层的质量降低引起的。

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