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Optical Inspection of EPL Stencil Masks

机译:EPL模板掩模的光学检查

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We are now at a major junction in lithography where non-optical lithographies, such as Electron Projection Lithography (EPL), are being introduced. The mask used in EPL is a silicon substrate with a thin silicon (~2μm) membrane, with openings for electrons to pass through, acting as a scatterer. This must be inspected as mask defects may print effecting pattern fidelity. Initial mask inspection work has used SEM inspection to find these defects. However, we have historically used optical mask inspection tools, utilising wavelengths at or above those we are using for imaging, to qualify masks. This technology has been increasingly difficult to sustain as we have moved from imaging using mercury lamp based sources to pulsed excimer laser based sources that are not very suited to the inspection imaging. Indeed, review of defects found has moved from optical microscopes to SEM based tools. Inspection tools have also evolved, with the first SEM based mask inspection tools being developed to find the smallest defects, however these have the penalty of very low throughput. We will show the potential of using optical systems for the transmissive inspection of EPL masks. The high potential of existing tools will be shown together with the need for a next generation of inspection tools. We will show that simulations indicate that an inspection source with 193nm wavelength would be required for the detection of 50nm defects on a mask. It will also be shown how the position of the defect within the membrane greatly influences detection as well as the implications of moving to a thinner silicon membrane.
机译:我们现在处于光刻中的主要连接,其中正在引入非光学光刻,例如电子投影光刻(EPL)。 EPL中使用的掩模是具有薄硅(〜2μm)膜的硅衬底,具有用于电子的开口通过,用作散射体。这必须被检查为掩模缺陷可能打印效果的模式保真度。初始掩模检查工作已使用SEM检查来查找这些缺陷。然而,我们在历史上使用了光学掩模检查工具,利用我们正在使用的波长或以上的波长来进行成像,以限定掩护。当我们从基于汞灯的源转移到脉冲基准激光的源不太适合检查成像的脉冲准分子激光源时,这项技术越来越难以维持。实际上,发现发现的缺陷已从光学显微镜移动到SEM基工具。检查工具也在演变,具有第一个SEM基础的面罩检查工具,以找到最小的缺陷,但这些缺陷具有极低的吞吐量。我们将展示使用光学系统进行EPL掩码的透射检查的潜力。现有工具的高潜力将与下一代检验工具一起显示。我们将展示模拟表明,在掩模上检测50nm缺陷,将需要具有193nm波长的检查源。还还将显示膜内的缺陷位置如何极大地影响检测以及移动到更薄的硅膜的含义。

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