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Embedded test solution as a breakthrough in reducing cost of test for system on chips

机译:嵌入式测试解决方案是降低片上系统测试成本的突破

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The cost of test for SoCs (system-on-chips) is tremendous, especially for large and complex designs. Although the high price of ATE (Automatic Test Equipment) is recognized as the primary contributor of test cost, and is therefore most highlighted, high test costs are also caused by factors related to engineering flows ranging from design to manufacturing. In this paper, the discussion will focus on test cost reduction, with all such factors taken into account. A potential difficulty in this discussion is that it is generally difficult to achieve higher quality and lower cost at the same time. In working with several leading edge semiconductor companies in the United States and Japan, the authors have observed and analyzed the whole picture of current flows in design and manufacturing test, including quantitative study of the cost of test. Based upon the results of this analysis, a proposed solution is analyzed, based upon effectiveness in achieving two goals: higher quality and lower costs.
机译:SoC(片上系统)的测试成本非常高,特别是对于大型和复杂的设计。尽管ATE(自动测试设备)的高价格被认为是测试成本的主要因素,因此最受关注,但高昂的测试成本也由与工程流程有关的因素引起,这些因素涉及从设计到制造的整个过程。在本文中,讨论将集中在降低测试成本上,同时考虑所有这些因素。该讨论中的潜在困难在于,通常难以同时实现更高的质量和更低的成本。通过与美国和日本的多家领先的半导体公司合作,作者观察并分析了设计和制造测试中电流的整体情况,包括对测试成本的定量研究。基于此分析的结果,将基于实现两个目标的有效性来分析提议的解决方案:更高的质量和更低的成本。

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