In this report a new wire feeding system for fine wire bonding machines and its development is presented. The system is driven by a piezoelectric actuator, which replaces the electromagnetic actuators used in present bonding machines. To minimize the time used to develop the piezoelectric system, several models of the system have been derived and simulations have been made, to optimize the systems performance. After the wire feeding system has been manufactured, experiments have been made to validate the results conceived from the simulations. The performance improvement to the currently used feeding system is discussed.
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