Effect of Tool Drop on the Performance of a High-Frequency Piezoelectric Wire-Bonding Transducer System

摘要

This work describes a method to determine a suitable tool drop for clamping the bonding tool in a high-frequency (130 kHz) piezoelectric ham transducer used for wire bonding. Effect of different tool drops on four critical parameters, namely, the resonant frequency, the electrical impedance, the phase angle, and the tool tip displacement amplitude, were studied with the transducer system being driven at normal bonding power. Strong interdependence was observed among these parameters. The results were interpreted from the system stability and other physical point of views. Appropriate ranges of tool drop were found. With the tool drop in these ranges, it can produce desirable characteristics for the wire bonding.