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Semiconductor technology trend and requirements for masks

机译:半导体技术趋势和对掩模的要求

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Abstract: The fabrication cost of the semiconductor device is increasing because the fabrication cost per wafer unit area and the mask cost are increasing rapidly with the design rule decreased. The rapid increase in the mask cost will influence the semiconductor industry growth. The progress in the lithography, including the mask, is the key issue for the progress in the entire semiconductor technology beyond 180 nm design rule, because the mask is indispensable for any types of lithography, and is regarded as one of the most critical technologies, both in resolution and productivity. To continue the progress in the entire semiconductor technology and the growth of the semiconductor business, it is indispensable to make challenges in the low cost and high precision mask technology under the cooperation with related industries and academia. It is especially important to develop the cost optimum solution for the total lithography technology including masks. !8
机译:摘要:随着设计规则的减少,每片晶圆单位面积的制造成本和掩模成本迅速增加,半导体器件的制造成本不断增加。掩模成本的快速增长将影响半导体产业的增长。包括掩模在内的光刻技术的进步,是整个半导体技术超越180 nm设计准则的关键问题,因为掩模对于任何类型的光刻技术都是必不可少的,并且被认为是最关键的技术之一,在分辨率和生产率上都如此。为了继续保持整个半导体技术的进步和半导体业务的增长,在与相关行业和学术界的合作下,低成本,高精度掩模技术面临的挑战是必不可少的。为包括掩模在内的整个光刻技术开发成本最优的解决方案尤为重要。 !8

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