首页> 外文会议>Industry Applications Conference, 1999. Thirty-Fourth IAS Annual Meeting. Conference Record of the 1999 IEEE >Evaluation of planar and trench IGBT for hard- and soft-switching performance
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Evaluation of planar and trench IGBT for hard- and soft-switching performance

机译:评估平面和沟槽IGBT的硬开关和软开关性能

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摘要

This paper presents a comparison of planar and trench IGBT in hard and soft-switching applications. Higher carrier density in trench IGBTs results in smaller cell size and improved conduction. It is shown that this increase in the concentration of excess charges also results in inferior turn-off performance. Hard-switching performance is dominated by turnoff losses. The trench IGBT under study has higher switching losses than identically rated planar IGBT. Soft switching results in significant reduction of the turn-off stress; thus promising an increase in switching frequency till the device becomes the limiting factor once again. High switching losses of trench IGBTs may be a setback from this consideration even as conduction performance of the device improves significantly. It is also shown that electrothermal consideration can significantly limit the short circuit withstanding capability of trench IGBTs in comparison with planar IGBT.
机译:本文对硬开关和软开关应用中的平面和沟槽IGBT进行了比较。沟槽IGBT中较高的载流子密度导致较小的单元尺寸和改善的导电性。结果表明,过量电荷浓度的这种增加也会导致关闭性能变差。硬开关性能主要由截止损耗决定。与同等额定平面IGBT相比,正在研究的沟槽IGBT具有更高的开关损耗。软开关可显着降低关断应力。因此,有希望增加开关频率,直到该器件再次成为限制因素为止。即使器件的传导性能得到显着改善,沟槽IGBT的高开关损耗也可能是这种考虑的挫折。还表明,与平面IGBT相比,电热因素会大大限制沟槽IGBT的短路耐受能力。

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