Ensuring Quality with 'in-Process Inspection' for PCB Assembly. Implementing (AOI) automatic Optical Inspection, when, where and How?

摘要

The days of inspection by the naked eye are essentially over. The demand for higher throughput, combined with high board densities, complex mixed technology boards, and smaller devices, have all but eliminated individual inspectors on the assembly line; and yet, despite advances in the performance capabilities of process equipment, the need to ensure board quality is as essential as ever. With systems stressed to maintain speed and precision while handling finer pitched components, defects are a fact of life during paste deposition, component placement, and reflow. This paper studies the different methods of implementing Automatic Optical Inspection (AOI) in the PCB assembly process.