Ad printed-circuit boards become ever more complex, it becomes increasingly difficult for manufactureers to ensure that they work properly before they leave the factory. "One size fits all" test approaches can no longer provide all of the answers. In-circuit test and other bed-of-nails techniques may fall short. Densely packed surface-mounted components often populte both boaard sides, defying access by conventional methods. Designing flxtures requires considerable creativity, if not outright magic. Beds-of-nails also complicate testing of high-frequency boards for applicatios such as communications because they alter radio frequency signals.
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