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LOW-TEMPERATURE THERMAL, DIELECTRIC, AND ACOUSTIC PROPERTIES OF AMORPHOUS POLYMERS

机译:非晶态聚合物的低温热,介电和声学性质

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The thermal conductivity X, the specific heat c, the thermal expansion a, the acoustic and dielectric properties of polycarbonate (PC), of polystyrene (PS) and of an epoxy resin were measured in the temperature ranges between 0.1 K and 80 K (λ, c) and between 4K and 300 K (a). The measurements show the typical low-temperature behavior of amorphous solids. Below 20 K the results can be explained in the framework of the soft potential model. Above 20 K with increasing temperature X and a show between 30 K and 50 K a distinct decrease in slope of the temperature dependence. The sound velocity shows for PC and PS the typical decrease with increasing temperature. For PC the maximum in the dielectric losses shifts with increasing frequency and at increasing pressure to higher temperature.
机译:在0.1 K至80 K(λ)的温度范围内测量了热导率X,比热c,热膨胀a,聚碳酸酯(PC),聚苯乙烯(PS)和环氧树脂的声学和介电性能,c),且介于4K和300 K(a)之间。测量结果显示了非晶态固体的典型低温行为。在20 K以下,可以在软势模型的框架中解释结果。超过20 K时,温度X升高,并且在30 K和50 K之间显示出温度依赖性的斜率明显降低。对于PC和PS,声速显示出随着温度升高典型的下降。对于PC,最大的介电损耗随频率的增加和压力的升高而变化,直至温度升高。

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