Fabrication of micromachined microwave couplers by CMOS process

摘要

Since the 0.6 $mu@m SPTM (Single Polysilicon and Three Metals) process provided by TSMC (Taiwan Semiconductor Manufacturer Company) has three metal layers available, miscellaneous microwave passive components are feasible and easily fabricated. The aim of our study is to minimize the conventional microwave couplers by commercial CMOS process. Combining communication application and semiconductor technology, this study takes advantages as following: (1) Miniaturization of the microwave passive components is feasible by CMOS process. (2) Only small area is required. (3) Microwave characteristics can be tested on-wafer. (4) Almost following the commercial CMOS process provided by TSMC, there is no post-process.