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Surface texturing and chemical treatment methods for reducing high adhesion forces at micromachine interfaces

机译:表面纹理化和化学处理方法可降低微机界面的高附着力

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Abstract: Microelectromechanical systems (MEMS) is a relatively new field dealing with the design and manufacturing of miniaturized devices (micromachines) using techniques adapted mainly from the integrated-circuit industry. Micromachine fabrication comprises the growth, deposition, and selective removal of thin films. Early indications suggest that although significant opportunities exist for MEMS, there are several obstacles preventing the evolution of micromachines from the research environment to the application world. Among challenging problems is the identification and analysis of microscopic processes encountered at MEMS interfaces during fabrication and operation that often render the devices dysfunctional. The development of high adhesion forces at micromachine interfaces during release-etch drying and/or operation often leads to permanent adhesion of contacting surfaces, a phenomenon referred to as stiction, hence affecting the micromachine yield and operation life. In this publication, an appraisal of the important issues involved in micromachine stiction is presented, accompanied by an assessment of the contribution of various surface forces (e.g., van der Waals, capillary, electrostatic, and asperity deformation forces) to the total stiction force arising at MEMS interfaces. The critical micromachine stiffness required to overcome stiction is interpreted in terms of the composite surface roughness and material properties. In addition, various surface modification techniques compatible with standard surface micromachining, such as surface roughening (texturing) and deposition of low surface energy films (e.g., diamond-like carbon coatings and self-assembled monolayer films) are presented, and their efficacy to reduce etch- release and in-use micromachine stiction is discussed in light of experimental and analytical results. !48
机译:摘要:微机电系统(MEMS)是一个相对较新的领域,涉及使用主要从集成电路行业改编的技术来设计和制造小型设备(微型机器)的技术。微机械制造包括薄膜的生长,沉积和选择性去除。早期迹象表明,尽管MEMS存在着巨大的机遇,但仍有许多障碍阻碍了微型机器从研究环境向应用领域的发展。具有挑战性的问题之一是在制造和操作过程中,在MEMS接口处遇到的微观过程的识别和分析,这些过程常常使设备无法正常工作。在释放蚀刻干燥和/或操作期间在微机界面处产生高粘附力通常会导致接触表面的永久粘附,这种现象称为粘着现象,因此会影响微机的产量和使用寿命。在该出版物中,对微机械静摩擦中涉及的重要问题进行了评估,并评估了各种表面力(例如,范德华力,毛细管力,静电力和粗糙变形力)对产生的总静摩擦力的贡献。在MEMS接口上。克服摩擦所需的临界微机械刚度是根据复合材料的表面粗糙度和材料性能来解释的。此外,还介绍了与标准表面微加工兼容的各种表面改性技术,例如表面粗糙化(纹理化)和低表面能薄膜(例如,类金刚石碳涂层和自组装单层薄膜)的沉积,以及降低这些功效的功效。根据实验和分析结果,讨论了蚀刻释放和使用中的微机械静摩擦。 !48

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