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Surface texturing and chemical treatment methods for reducing high adhesion forces at micromachine interfaces

机译:用于减少微机械界面的高粘附力的表面纹理和化学处理方法

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Microelectromechanical systems (MEMS) is a relatively new field dealing with the design and manufacturing of miniaturized devices (micromachines) using techniques adapted mainly from the integrated-circuit industry. Micromachine fabrication comprises the growth, deposition, and selective removal of thin films. Early indications suggest that although significant opportunities exist for MEMS, there are several obstacles preventing the evolution of micromachines from the research environment to the application world. Among challenging problems is the identification and analysis of microscopic processes encountered at MEMS interfaces during fabrication and operation that often render the devices dysfunctional. The development of high adhesion forces at micromachine interfaces during release-etch drying and/or operation often leads to permanent adhesion of contacting surfaces, a phenomenon referred to as stiction, hence affecting the micromachine yield and operation life. In this publication, an appraisal of the important issues involved in micromachine stiction is presented, accompanied by an assessment of the contribution of various surface forces (e.g., van der Waals, capillary, electrostatic, and asperity deformation forces) to the total stiction force arising at MEMS interfaces. The critical micromachine stiffness required to overcome stiction is interpreted in terms of the composite surface roughness and material properties. In addition, various surface modification techniques compatible with standard surface micromachining, such as surface roughening (texturing) and deposition of low surface energy films (e.g., diamond-like carbon coatings and self-assembled monolayer films) are presented, and their efficacy to reduce etch- release and in-use micromachine stiction is discussed in light of experimental and analytical results.
机译:微机电系统(MEMS)是一种与主要来自集成电路行业的技术的设计和制造的相对较新的场地处理和制造小型化装置(微磁管)。微机制制造包括薄膜的生长,沉积和选择性去除。早期适应症表明,虽然MEMS存在重大机会,但有几种障碍防止了从研究环境到应用世界的微鼠进展。在挑战性问题中,在制造和操作期间MEMS接口遇到的微观过程的识别和分析通常使设备能够功能失调。在释放蚀刻干燥和/或操作期间的微机器界面的高粘附力的发展通常导致接触表面的永久粘附,这是一种称为静止的现象,因此影响微机产率和操作寿命。在本出版物中,提出了对涉及微机枪沉降的重要问题的评估,并伴随着各种表面力(例如,van der Waals,毛细管,静电和粗糙度变形力)对所产生的总静态力的贡献进行评估在MEMS接口。在复合表面粗糙度和材料性质方面解释了克服静态所需的临界微机刚度。另外,呈现与标准表面微机械线相容的各种表面改性技术,例如表面粗糙化(纹理)和低表面能膜的沉积(例如,金刚石状碳涂层和自组装的单层膜),并且它们减少的功效根据实验和分析结果讨论了蚀刻释放和使用的微小微小静态。

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