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RF magnetron sputtering deposition of CdTe passivation on HgCdTe

机译:RF磁控管溅射CDTE钝化对HGCDTE的钝化

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In this study, we report the RF magnetron sputtering growth and characterization of CdTe passivant on bulk n-type HgCdTe. Our investigations include the HgCdTe surface preparation and in-situ pretreatment, deposition-induced surface damage, interface charge, CdTe film stoichiometry, and thermal stability. The metal-insulator-semiconductor test structures are processed and their electrical properties are measured by capacitance-voltage characteristics. The heterostructures are also characterized by reflectance measurement. In order to investigate the passivation properties of CdTe/HgCdTe heterostructures, we have modeled the band diagram of abrupt CdTe/HgCdTe heterojunction. The effect of sputtering growth condition parameters is also reported. The sputtering CdTe layers, exhibit excellent dielectric, insulating and mechano- chemical properties, as well as interface properties. The interfaces are characterized by slight accumulation and a small hysteresis. A carefully controlled growth process and surface pretreatment tailored to the specific material are required in order to obtain near flat band conditions on n- type materials. Additional informations on surface limitations are obtained from analyzing the I-V characteristics of photodiodes with metal gates covering the p-n junction surface location.
机译:在这项研究中,我们报道了抗批量N型HGCDTE上CDTE钝化剂的RF磁控溅射生长和表征。我们的研究包括HGCDTE表面制备和原位预处理,沉积诱导的表面损伤,界面电荷,CdTe膜化学计量和热稳定性。处理金属绝缘体 - 半导体测试结构,通过电容 - 电压特性测量它们的电性能。异质结构的特征在于反射测量。为了研究CDTE / HGCDTE异质结构的钝化性能,我们已经建模了突然CDTE / HGCDTE异质结的带图。还报道了溅射生长条件参数的影响。溅射CDTE层,具有出色的电介质,绝缘和机械化学性质,以及界面性质。界面的特征在于轻微积聚和小滞后。需要仔细控制的生长过程和对特定材料定制的表面预处理,以便在N型材料上获得近扁平带条件。从覆盖P-n结表面位置的金属栅极分析光电二极管的I-V的I-V特性,获得了关于表面限制的附加信息。

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