首页> 外文会议>Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International >Deep-trap SILC (stress induced leakage current) model for nominal and weak oxides
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Deep-trap SILC (stress induced leakage current) model for nominal and weak oxides

机译:适用于标称和弱氧化物的深阱SILC(应力感应泄漏电流)模型

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We have successfully developed a new quantitative ITAT (inelastic trap-assisted tunneling) based SILC (stress induced leakage current) model by introducing traps with a deep energy level of around 4.0 eV which can explain two field dependencies, i.e. Fowler-Nordheim (FN) field and the direct tunneling (DT) field dependence. For simple analytical models, we introduce the most favorable trap position, which gives the largest contribution to the leakage current. A-mode and B-mode SILC are the leakage currents in the nominal oxide region and at the weak oxide spots, respectively, which can be deduced by the large difference in the area density between the single trap area (/spl sim/1/spl times/10/sup 11/ cm/sup -2/) and the multi-trap path (/spl sim/1/spl times/10/sup 2/ cm/sup -2/). Our model suggests that for flash EPROM, a 13 nm-oxide thickness is required for 1.0 fC on the floating gate to last 100 years.
机译:通过引入能级约为4.0 eV的深能级的陷阱,我们已经成功开发了新的基于定量ITAT(非弹性陷阱辅助隧穿)的SILC(应力引起的漏电流)模型,该陷阱可以解释两个场依赖性,即Fowler-Nordheim(FN)场和直接隧道(DT)场相关性。对于简单的分析模型,我们介绍了最有利的陷阱位置,它对泄漏电流的贡献最大。 A模式和B模式SILC分别是标称氧化物区域和弱氧化物斑点处的泄漏电流,可以通过单个阱面积之间的面积密度差异大(/ spl sim / 1 / spl times / 10 / sup 11 / cm / sup -2 /)和多陷阱路径(/ spl sim / 1 / spl times / 10 / sup 2 / cm / sup -2 /)。我们的模型表明,对于闪存EPROM,浮栅上的1.0 fC电容需要13 nm的氧化物厚度才能持续100年。

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