首页> 外文会议>Indium Phosphide and Related Materials, 1998 International Conference on >Systematics of electrical conductivity across InP to GaAs wafer fused interfaces
【24h】

Systematics of electrical conductivity across InP to GaAs wafer fused interfaces

机译:InP到GaAs晶片熔合界面的电导率系统

获取原文

摘要

We report on the electrical and compositional characterization of wafer fused isotype heterojunctions between Zn, C or Si doped GaAs and Zn or Si doped InP. The junctions were characterized with current-voltage and secondary ion mass spectrometry (SIMS) measurements. It is demonstrated that very low-resistive junctions can be obtained in each case, but also that there is a strong influence from the detailed sample structure and processing conditions. SIMS was used to monitor the doping concentration across the interface as well as the impurity concentration of oxygen, carbon and iron.
机译:我们报告了在Zn,C或Si掺杂的GaAs与Zn或Si掺杂的InP之间的晶片熔融同种异质结的电学和成分表征。通过电流-电压和二次离子质谱(SIMS)测量来表征结。结果表明,在每种情况下都可以得到非常低的电阻结,但是详细的样品结构和加工条件也有很大的影响。 SIMS用于监控界面上的掺杂浓度以及氧,碳和铁的杂质浓度。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号