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Passivation of InP-based heterostructure bipolar transistors-relation to surface Fermi level

机译:基于InP的异质结构双极晶体管的钝化-与表面费米能级的关系

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The effect of the surface Fermi level position on the dc characteristics of InP-base heterostructure bipolar transistors (HBTs) is examined. The Fermi level of an InP surface covered with silicon oxide was located at an energy position close to the conduction band minimum of InP. This implies formation of an electron accumulation layer at the interface, which acts as a surface leakage path. The HBT passivated with silicon-oxide film showed a huge excess base current and poor current gain. In contrast, the Fermi level position at the silicon-nitride/InP interface was found to be near the midgap, and no electron accumulation layer formed at the interface. The HBT passivated with silicon-nitride film showed excellent dc characteristics with a very small excess base current.
机译:研究了表面费米能级位置对InP基异质结构双极晶体管(HBT)直流特性的影响。被氧化硅覆盖的InP表面的费米能级位于接近InP的导带最小值的能量位置。这意味着在界面处形成电子累积层,该电子累积层用作表面泄漏路径。用氧化硅膜钝化的HBT表现出巨大的基极电流和差的电流增益。相反,发现在氮化硅/ InP界面处的费米能级位置接近中间能隙,并且在界面处没有形成电子累积层。用氮化硅膜钝化的HBT表现出出色的dc特性,具有非常小的过剩基极电流。

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