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Highly controllable electrochemical etching of InP studied by voltammetry and scanned probe microscope

机译:伏安法和扫描探针显微镜研究的InP高度可控电化学蚀刻

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Electrochemical etching of n-InP surfaces is studied by using voltammetry, XPS, in situ electrochemical STM, ex situ AFM and SEM measurements in order to characterize and optimize the etching process. The voltammograms indicated occurrence of the active-passive transition. The surfaces etched by the optimal anodic condition were clean and featureless with an rms roughness of 2.5 nm, whereas the surfaces obtained in the passive region were porous. The optimum avalanche pulse etching mode realized an extremely high etch depth controllability of 6/spl times/10/sup -5/ nm/pulse.
机译:通过伏安法,XPS,原位电化学STM,异位AFM和SEM测量研究了n-InP表面的电化学刻蚀,以表征和优化刻蚀过程。伏安图表明发生了主动-被动过渡。在最佳阳极条件下蚀刻的表面干净无瑕,均方根粗糙度为2.5 nm,而在无源区域中获得的表面则是多孔的。最佳的雪崩脉冲蚀刻模式实现了6 / spl倍/ 10sup -5 / nm /脉冲的极高蚀刻深度可控性。

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