首页> 外文会议>Electron Devices Meeting, 1998. IEDM '98 Technical Digest., International >Experimental signature and physical mechanisms of substrate enhanced gate current in MOS devices
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Experimental signature and physical mechanisms of substrate enhanced gate current in MOS devices

机译:MOS器件中衬底增强栅极电流的实验特征和物理机制

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This paper examines in detail the phenomenon of Substrate Enhanced Electron Injection (SEEI). By using floating gate devices less aggressively scaled than the MOSFETs of Bude (1995) we are able to: (1) develop criteria to separate SEEI from the coexisting channel hot electron (CHE) injection; (2) point out a direct proportionality between the gate (I/sub G/) and the substrate (I/sub B/) currents that provides a signature of SEEI; (3) reconcile SEEI with reported mechanisms of optical minority carrier generation in the substrate.
机译:本文详细研究了衬底增强电子注入(SEEI)现象。通过使用比Bude(1995)的MOSFET规模较小的浮栅器件,我们能够:(1)制定标准,以将SEEI与共存沟道热电子(CHE)注入区分开; (2)指出栅极电流(I / sub G /)与衬底电流(I / sub B /)之间的正比关系,该比例提供了SEEI的特征; (3)使SEEI与已报道的在衬底中产生少数光学载流子的机理相一致。

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