首页> 外文会议>Electromagnetic Compatibility, 1998. 1998 IEEE International Symposium on >The restriction on delta-I noise along the power/ground layer in the highspeed digital printed circuit board
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The restriction on delta-I noise along the power/ground layer in the highspeed digital printed circuit board

机译:高速数字印刷电路板中电源/接地层沿delta-I噪声的限制

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In the high-speed digital printed circuit board (PCB), there exists a layer capacitance (generally from 0.02 nF to 200 nF) between the closely spaced power and ground layers, which has some restriction on delta-I noise. According to the MPIE (mixed potential integral equation), a model is developed to analyze and characterize quantitatively the restriction on delta-I noise by the power/ground structure in PCB in high frequencies (from 100 MHz to 3 GHz). In comparison with the measured data from a testboard, the method produces relatively precise results. The restriction on delta-I noise is complicated by the high frequency and several strategies are provided to reduce the noise.
机译:在高速数字印刷电路板(PCB)中,在紧密间隔的电源层和接地层之间存在一个层电容(通常为0.02 nF至200 nF),这对delta-I噪声有一定的限制。根据MPIE(混合势积分方程),开发了一个模型,用于分析和定量表征PCB在高频(从100 MHz到3 GHz)中的电源/接地结构对δ-I噪声的限制。与来自测试板的测量数据相比,该方法可产生相对精确的结果。高频干扰了对delta-I噪声的限制,并提供了几种降低噪声的策略。

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