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High-deposition-rate a-Si:H throuhg VHF-CVD of argon-diluted silane

机译:氩气稀释的硅烷的高沉积速率a-Si:H透过VHF-CVD

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We discuss various ways to produce hydrogenated amorphous silicon.a-Si:H, at a high deposition rate. We also present results of our recent study on the structural properties of a-Si:H films deposited at high rates using argon (Ar) dilution of silane in a 50-MHz glow discharge.The results of the depositions with Ar dilution are compared to films deposited from pure silane,Si:H_4. The deposition rate r_d is changed by varying the rf power P_rf into the discharge.We focus on the P-rf-dependence of the hydrogen (H) bonding configuration and total H- content in the film. It is observed that r_d saturates at 14 A/s for pure SiH_4 and at 22 A/s for Ar-diluted SiH_4 deposition.Upon increase of P_rf the H bonding configuration changes from mostly isolated H to mostly clustered H, and back to mostly isolated H. It is argued that Ar~* metastable atoms play an important role in the growth mechanism at intermediate P_rf, whereas at high P_rf ion bombardment through Ar~+ and SiH_x~+ (x<=3) ions becomes curcial. Two high-rate a-Si:H films are incorporated in thin-film transistors, TFTs. We presnet their characteirstics before and after illumination with calibrated light.It is shown that a-Si:H TFT s with a saturation mobility of 0.7 cm~2/Vs can be fabricated,with the complete intrinsic layer deposited at 20 A/s.
机译:我们讨论了以高沉积速率生产氢化非晶硅.a-Si:H的各种方法。我们还介绍了我们最近在50MHz辉光放电中使用氩气(Ar)稀释硅烷对a-Si:H薄膜进行高速率沉积的结构特性的研究结果。由纯硅烷Si:H_4沉积的薄膜。沉积速率r_d通过改变射频功率P_rf改变到放电中而改变。我们着重研究氢键(H)键构型的P-rf依赖性以及薄膜中总H含量。观察到,纯SiH_4的r_d饱和度为14 A / s,而Ar稀释的SiH_4沉积的r_d饱和度为22 A / s.P_rf增大时,H键构型从几乎孤立的H变为大部分群集的H,然后又回到大部分隔离的H H.有人认为,Ar〜*亚稳原子在中间P_rf的生长机理中起着重要作用,而在高P_rf离子中,通过Ar〜+和SiH_x〜+(x <= 3)离子轰击变得至关重要。在薄膜晶体管TFT中集成了两个高速率的a-Si:H薄膜。我们在校准光照射之前和之后对其特性进行了预知。结果表明,可以制备饱和迁移率为0.7 cm〜2 / Vs的a-Si:H TFT s,并以20 A / s的速率沉积完整的本征层。

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