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Effect of thermal treatment on the hardness and fracture toughness of sputter deposited Bi-layered thin films on silicon

机译:热处理对硅溅射沉积双层薄膜硬度和断裂韧性的影响

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Microhardness testing is widely used for characterizing the mechanical properties of both bulk materials and thin films. Although this techniqeu is usually associated with hardness measurements, fracture properties of brittle materials can also be studied with cracking associated with microhardness indentations. It is well known that the length of radial cracks emanating from the corners of indents made with Vickers and Berkovich indenters is related to the fracture toughness of the material. In the present study, microhardness testing has been used to follow the evolution of the mechanical properties of a 10 nm.Cu/200 nm. Ni(V)/300 nm. Al(Cu) thin film deposited on a Si substrate. Composite hardness and fracture toughness have been followed as a function of heat treatment temperatures and times and were found to be dependent on both variables. The roles of residual stresses, interdiffusion, and intermediate phase formation in the observed variation in hardness and fracture toughness are discussed.
机译:微硬度测试广泛用于表征散装材料和薄膜的机械性能。虽然该技术QeU通常与硬度测量相关,但也可以用与显微硬度凹进相关的裂缝来研究脆性材料的断裂性质。众所周知,从用Vickers和Berkovich压痕制成的缩进角落的径向裂缝的长度与材料的断裂韧性有关。在本研究中,已经使用微硬度测试来遵循10nm.cu / 200nm的机械性能的演变。 NI(v)/ 300nm。 Al(Cu)薄膜沉积在Si衬底上。已遵循复合硬度和断裂韧性作为热处理温度和时间的函数,并且发现依赖于两个变量。讨论了残余应力,间隔和中相形成在观察到的硬度和断裂韧性变化中的作用。

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