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Product-oriented BGA manufacturability and reliability study

机译:面向产品的BGA可制造性和可靠性研究

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摘要

Since 1993, many BGA board level manufacturability and reliability related papers have been published. Many of them were based on simple and non-product-oriented test boards. It is believed that a product-oriented BGA test vehicle design, assembled in a production environment, will provide more direct applicable information to BGA package users, and thus improve manufacturability and reliability of products utilizing BGA technology.
机译:自1993年以来,已经发表了许多BGA板级可制造性和可靠性相关的论文。其中许多基于简单且非面向产品的测试板。相信在生产环境中组装的面向产品的BGA测试车设计将为BGA封装用户提供更直接的适用信息,从而提高利用BGA技术的产品的可制造性和可靠性。

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