The signal distortion caused by the RLC parasitics associated with IC packages has become a factor of concern. This paper describes the application of three dimensional field solving software to model and extract parasitics associated with the wire bonds and package leads of a PQFP package. The simulated results are compared with the frequency domain measurement results and are found to be in good agreement. The Vector Network Analyser (VNA) based S-parameter measurement technique is used to obtain package inductance and capacitance. The measurement methodology and test set-up are presented in this paper. The package electrical parameters are determined per unit interconnect length.
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