Examination of glass-silicon and glass-glass bonding techniques for microfluidic systems

摘要

Abstract: We report here on the results of experiments concerning particular bonding processes potentially useful for ultimate miniaturization of microfluidic systems. Direct anodic bonding of continuous thin pyrex glass of 250 $mu@m thickness to silicon substrates gives multiple, large voids in the glass. Etchback of thick glass of 1200 $mu@m thickness bonded to silicon substrates gives thin continuous glass layers of 189 $mu@m thickness without voids over areas of 5 cm $MUL 12 cm. Glass was also successfully bonded to glass by thermal bonding at 800 degrees C over a 5 cm $MUL 7 cm area. Anticipated applications include microfabricated DNA sequencing, flow injection analysis, and liquid and gas chromatography microinstruments. !8