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Silicon-on-Silicon Multichip Modules: Technology and Applications

机译:硅上硅多芯片模块:技术和应用

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The long awaited Multip-Chip Module (MCM) market has finally arrived. This paper presents the state-of-the-art of the Silicun-on-Silicon MCM technology and describes some typical MCM products for both high performance digital applications and low cost mixed signal applications. By low cost Silicon-on-Silicon MCMs, we mean a few chip MCMs on a small silicon substrate which can be packaged into a standard IC package. Low cost Silicon-on-Silicon MCMs will continue to pave the way for accelerating the commercial availability and utilization of the technology.
机译:期待已久的多芯片模块(MCM)市场终于到来了。本文介绍了Silicun-on-Silicon硅MCM技术的最新技术,并介绍了一些既适用于高性能数字应用又适用于低成本混合信号应用的典型MCM产品。所谓低成本硅上MCM,是指在小的硅基板上可以封装成标准IC封装的几个芯片MCM。低成本的硅上MCM将继续为加速该技术的商业可用性和利用铺平道路。

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