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首页> 外文期刊>IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging >A silicon-on-silicon field programmable multichip module (FPMCM)integrating FPGA and MCM technologies
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A silicon-on-silicon field programmable multichip module (FPMCM)integrating FPGA and MCM technologies

机译:集成了FPGA和MCM技术的硅上硅现场可编程多芯片模块(FPMCM)

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Multichip module technology can dramatically increase the capability of field programmable logic devices (FPLD's) and field programmable systems (FPS). We present the special advantages that MCM's offer FPLD's and the design of our first-generation field programmable multichip module (FPMCM). Our prototype is the first silicon-on-silicon FPMCM and has a maximum capacity of 40 K gates and 256 user IO, achieving a factor of four increase in capacity over the FPLD family with which it was designed. Our FPMCM has bean demonstrated in a system that can deliver 200 MOP's of computing power for image processing applications. FPMCM's can cost-effectively deliver 4-8 times the capacity of the largest FPLD's and provide even larger reductions in the area of PCB-based field programmable systems. The upper capacity limits for FPMCM are determined mainly by the cost and defect density of the substrate technology. As CMOS processes move into the deep-submicron range, FPMCM's will even faster and denser substrates
机译:多芯片模块技术可以极大地提高现场可编程逻辑器件(FPLD)和现场可编程系统(FPS)的能力。我们展示了MCM提供的FPLD的特殊优势以及我们的第一代现场可编程多芯片模块(FPMCM)的设计。我们的原型是第一个硅上硅FPMCM,最大容量为40 K门和256个用户IO,与设计该FPLD系列相比,容量增加了四倍。我们的FPMCM在系统中演示了bean,该系统可以为图像处理应用程序提供200 MOP的计算能力。 FPMCM可以经济高效地提供最大FPLD容量的4到8倍,并且可以大大缩小基于PCB的现场可编程系统的面积。 FPMCM的容量上限主要由基板技术的成本和缺陷密度决定。随着CMOS工艺进入深亚微米范围,FPMCM将更快,更致密的基板

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