首页> 外文会议>Reliability Physics Symposium, 1994. 32nd Annual Proceedings., IEEE International >Stress-induced low-level leakage mechanism in ultrathin silicon dioxide films caused by neutral oxide trap generation
【24h】

Stress-induced low-level leakage mechanism in ultrathin silicon dioxide films caused by neutral oxide trap generation

机译:中性氧化物陷阱产生导致超薄二氧化硅薄膜中应力诱导的低水平泄漏机理

获取原文

摘要

Stress-induced low-level leakage current in ultrathin silicon dioxide films is correlated with neutral oxide trap generation based on first-order kinetics. The conduction mechanism is explained by Fowler-Nordheim tunneling from the leakage spot, generated at the cathode interface, to the neutral oxide trap level, lower in energy than the SiO/sub 2/ barrier height.
机译:基于一阶动力学,超薄二氧化硅薄膜中应力诱导的低电平泄漏电流与中性氧化物陷阱的产生相关。导电机理可以通过Fowler-Nordheim隧穿来解释,该隧穿从阴极界面处产生的泄漏点到能量低于SiO / sub 2 /势垒高度的中性氧化物陷阱能级。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号