首页> 外文会议>Indium Phosphide and Related Materials, 1994. Conference Proceedings., Sixth International Conference on >I-V kink in InAlAs/InGaAs MODFETs due to weak impact ionization process in the InGaAs channel
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I-V kink in InAlAs/InGaAs MODFETs due to weak impact ionization process in the InGaAs channel

机译:由于InGaAs通道中的弱电离过程,InAlAs / InGaAs MODFET中的I-V扭结

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InAlAs-In/sub 0.53/Ga/sub 0.47/As-InP MODFETs on InP substrates have demonstrated superior high frequency performance in recent years. However, the devices with sub-half-micron gate lengths often exhibit a detrimental "kink effect" in the I-V curves, which is a sudden increase in the saturated drain current with respect to drain bias. The devices also suffer from high output conductance, G/sub 0/, with value as high as 100 mS/mm compared to 30 mS/mm for the GaAs based MODFETs with the same geometry. This excessive G/sub 0/ value degrades the voltage gain G/sub mG/sub 0/, and consequently the power gain and f/sub max/. Another serious problem for the device is the low drain to source breakdown voltage, which imposes a severe limitation on its power applications. Although the anomalous characteristics have been studied extensively, the original cause is still controversial. The speculative theories range from field de-ionization of trapped electrons in the InAlAs buffer layer to buffer layer conduction due to deconfinement of 2DEG from the InGaAs channel. The trap related theory contradicts the fact that when the narrow band gap InGaAs channel layer is replaced by a wider band material such as InGaAsP or InP, while keeping the same InAlAs as the buffer layer, the G/sub 0/ value of the device is much lower and the I-V kink is absent. The buffer conduction theory agrees well to the normally low G/sub 0/ value for the GaAs based MESFETs and MODFETs, but does not explain the excessive G/sub 0/ observed on InP based InAlAs/InGaAs MODFETs. Based on the facts that (i) the value of the G/sub 0/ is proportional to the electric field in the region near the drain side of the gate edge, and (ii) light emission was observed from the device with high G/sub 0/, we believed that the excessive G/sub 0/ and I-V kink for this device were related to weak impact ionization process in the InGaAs channel. In order to clearly understand the actual mechanism causing the I-V kink and excessive G/sub 0/, we conducted a series of carefully designed experimental and theoretical studies. The influences of InAlAs buffer layer and the InGaAs channel layer on the anomalies were investigated by using several device structures. The experimental results indicated that the weak impact ionization in the narrow band InGaAs channel is responsible for anomalies. The occurrence of impact ionization was confirmed by detection of light emission from the device. We then calculated the impact ionization rate and estimated the accumulated hole concentration in the channel. Based on all the experimental data and calculation results, we constructed the models to explain the anomalies.
机译:近年来,InP衬底上的InAlAs-In / sub 0.53 / Ga / sub 0.47 / As-InP MODFET已显示出优异的高频性能。然而,具有亚半微米栅极长度的器件通常在I-V曲线中表现出有害的“扭结效应”,这是饱和漏极电流相对于漏极偏置的突然增加。器件还具有较高的输出电导G / sub 0 /,其值高达100 mS / mm,而具有相同几何形状的基于GaAs的MODFET的电导值为30 mS / mm。该过大的G / sub 0 /值会使电压增益G / sub mG / sub 0 /下降,从而使功率增益和f / sub max /下降。该器件的另一个严重问题是漏极至源极的击穿电压低,这严重限制了其电源应用。尽管已经对异常特征进行了广泛的研究,但其原始原因仍存在争议。推测性理论的范围从InAlAs缓冲层中捕获电子的场去电离到2GaG通道从InGaAs通道脱出引起的缓冲层导通。与陷阱有关的理论与以下事实相矛盾:当窄带隙InGaAs沟道层被较宽的带材料(例如InGaAsP或InP)代替,同时保持与缓冲层相同的InAlAs时,器件的G / sub 0 /值为低得多,并且没有IV扭结。缓冲导通理论与基于GaAs的MESFET和MODFET的通常较低的G / sub 0 /值非常吻合,但不能解释在基于InP的InAlAs / InGaAs MODFET上观察到的过量G / sub 0 /。基于以下事实:(i)G / sub 0 /的值与靠近栅极边缘的漏极侧的区域中的电场成比例,并且(ii)从具有高G /子0 /,我们认为该器件的过量G / sub 0 /和IV扭结与InGaAs通道中的弱碰撞电离过程有关。为了清楚地了解导致I-V扭结和过量G / sub 0 /的实际机制,我们进行了一系列精心设计的实验和理论研究。通过使用几种器件结构,研究了InAlAs缓冲层和InGaAs沟道层对异常的影响。实验结果表明,窄带InGaAs通道中的弱碰撞电离是造成异常的原因。通过检测该装置的发光确认了碰撞电离的发生。然后,我们计算了碰撞电离率并估算了通道中累积的空穴浓度。根据所有实验数据和计算结果,我们构建了解释异常的模型。

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