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High resistive undoped Al/sub 0.48/In/sub 0.52/As layers grown by MOCVD

机译:通过MOCVD生长的高电阻无掺杂Al / sub 0.48 / In / sub 0.52 / As层

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It is shown that the resistivity and the conduction type of undoped MOCVD Al/sub 0.48/In/sub 0.52/As layers depend strongly on the growth temperature (450/spl deg/C-650/spl deg/C). The conduction type changes from n-type, semi-insulating and p-type with the decrease of the growth temperature. High resistivity over 2/spl times/10/sup 8/ /spl Omega/-cm is successfully obtained from undoped Al/sub 0.48/In/sub 0.52/As layers grown at 500/spl deg/C. With help of SIMS and ICTS, it is found that the resistivity is substantially determined by the incorporation of carbon whose incorporation rate depends strongly on the growth temperature. The incorporated carbon compensates the native deep donors. The good selective growth of undoped Al/sub 0.48/In/sub 0.52/As layers is also achieved at even low growth temperature of 500/spl deg/C.
机译:结果表明,未掺杂的MOCVD Al / sub 0.48 / In / sub 0.52 / As层的电阻率和导电类型在很大程度上取决于生长温度(450 / spl deg / C-650 / spl deg / C)。随着生长温度的降低,导电类型从n型,半绝缘和p型变化。从以500 / spl deg / C生长的未掺杂Al / sub 0.48 / In / sub 0.52 / As层成功地获得了2 / spl次/ sup 8 / spl的高电阻率Omega / -cm。借助于SIMS和ICTS,发现电阻率基本上是由碳的掺入确定的,碳的掺入率在很大程度上取决于生长温度。掺入的碳补偿了天然的深供体。即使在500 / spl deg / C的低生长温度下,也可以实现未掺杂的Al / sub 0.48 / In / sub 0.52 / As层的良好选择性生长。

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