Microwave and millimeter-wave packaging and interconnection methods for single and multiple chip modules

摘要

Advancements in IC technologies provide for increased speed, frequency, power and functional complexity within an extremely small area. To effectively support these devices, packaging and interconnection methods that promote the integration of analog, digital, and microwave circuit designs are used. As frequency increases, the high degree of interconnection at the chip level must continue up through the packaging level. Multilayer ceramic technology is a prefered packaging approach for many reasons. It offers the ability to route a dense amount of circuitry in a three-dimensional space, it provides for closely spaced, low loss RF interconnect, it allows for low structure which can withstand extreme environments. Multilayer ceramic packaging also offers a low cost alternative for high volume package manufacturing. The authors review four distinct packaging schemes in terms of function, construction and application in order to represent the influence of packaging on overall module and system design.