A new method for measuring the tin content of flip-chip solder bumps is described. This method uses a combination of gravimetric analysis and fluorescent X-ray spectrometry, which allows it to measure low Sn ratio of less than 2%. It also improves the repeatability to 0.2% compared with 4.3% for conventional methods that use integrated circuit piezoelectric (ICP) atomic emission spectrometry. This method also reduces the measurement time by 75%.
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