Performance comparison of single- and multiple-chip packages in a personal computer application

摘要

The multi-chip module (MCM) package shows considerable improvement in performance and signal quality as compared to single-chip modules on cards. It can support 40-45% faster clock rates due to reduced clock skews and distortions. It also yields 40-45% better net delays due to reduced capacitance loading, reduced effective time-of-flight delays, and shorter chip interconnect distances. The MCM package shows signal quality improvements for specific net cross sections due to reduced effective loadings, and a better controlled system. It also yields better electrical characteristic tolerances.