1992 Proceedings. 42nd Electronic Components and Technology Conference (Cat. No.92CH3056-9)

摘要

The following topics are dealt with: trade-off/advanced packaging: manufacturing technology; optoelectronics (array technology); hybrid/MCM-C (multichip module-C) applications; adhesives; connectors; interconnections; solder; dielectric and MCM materials' performance modeling: MCM materials and packaging technology; plastic packaging; encapsulants and molding compounds; optoelectronics (packaging technology); test and failure analysis; and single-chip packaging.