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Microwave characterization of thin-film multi-chip module substrates and printed wiring boards accounting for frequency-dependent characteristic impedance

机译：薄膜多芯片模块基板和印刷线路板的微波表征，这取决于频率相关的特性阻抗

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《Electrical Performance of Electronic Packaging, 1992》|1992年|P.128-130|共3页
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Steer M.B.; Franzon P.D.;
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中图分类无线电电子学、电信技术;
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4. Microwave characterization of thin-film multi-chip module substrates and printed wiring boards accounting for frequency-dependent characteristic impedance [C] . Steer M.B., Franzon P.D., Institute of Electric and Electronic Engineer Conference on Electrical Performance of Electronic Packaging . 1992

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Microwave characterization of thin-film multi-chip module substrates and printed wiring boards accounting for frequency-dependent characteristic impedance

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