首页> 外文会议>Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International >TARGET: thermal accelerated reliability go-no-go environmental testing dynamic board thermal shock using a single liquid fluorocarbon bath
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TARGET: thermal accelerated reliability go-no-go environmental testing dynamic board thermal shock using a single liquid fluorocarbon bath

机译:目标:使用单个液态碳氟化合物浴对热加速可靠性进行不做环境测试动态板的热冲击

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摘要

TARGET, a novel method of accelerated thermal stress for board testing, is described. This method utilizes Fluorinert as the medium for rapid thermal energy transfer. Possible applications include environments for STRIFE testing and board debug. One of the most promising applications is in-line environmental stress screening (ESS). Boards receive a thorough temperature stress screen in the time taken for conventional go-no-go tests. The process is described in detail and analyzed. Data from initial experiments are presented.
机译:描述了目标,一种用于板测试的新型加速热应力方法。该方法利用Fluorinert作为快速热能传递的介质。可能的应用包括用于STRIFE测试和电路板调试的环境。在线应用环境压力筛选(ESS)是最有前途的应用之一。电路板在常规的“通过/不通过”测试中所花费的时间受到了彻底的温度应力测试。对该过程进行了详细描述和分析。给出了来自初始实验的数据。

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