Memory and apparatus for a thermally accelerated reliability testing

摘要

A method for rapidly changing temperatures of either an unpopulated printed circuit board or a completed printed circuit board assembly and testing operation thereof. The rapid temperature change nondestructively stresses the printed circuit board or assembly and uncovers many defects that are hard to discover by constant temperature test methods. Each unit under test is alternately bathed with cold perfluorinated liquid and hot perflourinated liquid to rapidly change it temperature from cold (273 degrees kelvin) to hot (333 degrees kelvin).