METHOD FOR GIVING THERMAL SHOCK TO ELECTRONIC PARTS, METHOD FOR TESTING THERMAL SHOCK, AND THERMAL SHOCK GIVING DEVICE USED THEREFOR

摘要

PURPOSE: To continuously give thermal shocks to electronic parts by making a hoop material continuously carried while the hoop material carry a large number of electronic parts to pass through a high-temperature bath after passing through a cooling section. ;CONSTITUTION: Electronic parts 8,... carried on a hoop-like frame F are cooled as the frame F is carried by blowing compressed air upon the parts 8 from the nozzle 12_a of a cooling section 12. After cooling, thermal shocks are given to the parts 8 by dipping the parts 8 in silicone oil 11 heated to, for example, about 260°C in a high-temperature bath 9. When the parts 8 are dipped in the oil 11, the heat of the bath 9 is transferred in the direction opposite to the carrying direction of the frame F, but the cold temperature given to the parts 8 in the cooling section 12 before dipping is transferred through the frame F in the carrying direction, offsetting the heat transfer in the opposite direction and lowering the temperature of the frame F to about a room temperature at the moment the frame F is dipped in the oil 11. Thus the temperatures of the dipped frame F and parts 8 carried on the frame F impulsively rise. Therefore, thermal shocks similar to the severe thermal shocks expected when the parts 8 are mounted by dipping in a solder bath are continuously given to the parts 8.;COPYRIGHT: (C)1993,JPO&Japio