首页> 外文会议>IEE Colloquium on New Directions in VLSI Design, 1989 >Isolating failure location by using a dynamic emission microscopy system -a specific IddQ fail case study
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Isolating failure location by using a dynamic emission microscopy system -a specific IddQ fail case study

机译:使用动态发射显微镜系统隔离故障位置-特定的IddQ故障案例研究

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The purpose of this paper is to present a novel failure analysis application of a dynamic emission microscopy system, which is implemented by photoemission microscopy coupled with a logic tester and corresponding software. The system not only filtered out spurious hot spots that would mislead analysts, but also caught valid emission spots on the failure block when very faint photoemission was caused by a small defect at the specific IddQ state. PFA (physical failure analysis) results are also revealed to show the fault isolation located by the dynamic emission microscopy, showing that the system is successful.
机译:本文的目的是提出一种动态发射显微镜系统的新型故障分析应用程序,该系统是通过将光发射显微镜与逻辑测试仪和相应的软件相结合来实现的。该系统不仅可以滤除可能误导分析人员的虚假热点,而且还可以在特定IddQ状态下的微小缺陷引起非常微弱的光发射时,在故障块上捕获有效的发射点。还显示了PFA(物理故障分析)结果,以显示通过动态发射显微镜确定的故障隔离位置,表明系统是成功的。

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