Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4th Industrial Revolution Era

摘要

The capability and diversity of high-performance microprocessors is increasing with each process technology generation to meet increasing application demands. The cooling designs for these chips must deal with larger temperature gradients across the die than previous generations. Dissipation of the thermal energy from heat generating parts to a heat sink via conduction occurs through a thermal interfacial material (TIM). One of the most important parameters of TIMs is their thermal conductivity that impacts the efficiency of the thermal management. Therefore, in this study, three new different types of TIMs with high thermal conductivity (> 20W/mK) were examined.In this paper, workability and reliability test results will be shown for metal sheet TIM (60W/mK), graphite sheet TIM (24W/mK) and silver (Ag) sintered TIM (50W/mK) materials. All test package sizes are covered with 52.5-mm body size or 45-mm body size for large package with > 45-mm body size in a flip chip ball grid array (FCBGA) package. The reliability test items are high-temperature storage (HTS) @ 150’C 1000hrs, temperature cycling (TC) ‘B’ 1000X and unbiased highly accelerated stress test (uHAST) for 96hrs. Open/short (O/S) test, scanning acoustic tomography (SAT) or X-ray analysis data are reported. Post reliability test, lid pull test results will be shown as well.