Thermal Conductivity,Elastic Modulus,and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging

摘要

The effective thermal conductivity,elastic modulus,and coefficient of thermal expansion of epoxy resins filled with ceramic fillers like silica,alumina,and aluminum nitride were determinde.The data obtained was compared with theoretical and semitheoretical equations n the literature that are used to predict the properties of two phase mixtures.It was found that ASgari's model provided a good estimate of the composite thermal conductivity.The Hashin-Shtrikman lower bound for composite modulus fits the modulus data fairly well at low concentrations of the filler.Also,it was found that the coefficients of thermal expansion of the filled composites lie in between Schapery's upper and lower bounds.